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856-10-010-10-003000

Part number 856-10-010-10-003000
Product classification Spring Loaded
Manufacturer Mill-Max
Description .050" PITCH SINGLE ROW SOLDERCUP
Encapsulation
Packing Bulk
Quantity 156
RoHS status YES
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Inventory:
Total number

Quantity

Price

Total price

1

$5.5230

$5.5230

10

$5.0190

$50.1900

25

$4.7460

$118.6500

50

$4.6410

$232.0500

100

$4.4205

$442.0500

250

$3.8640

$966.0000

500

$3.7590

$1,879.5000

1000

$3.2025

$3,202.5000

2500

$2.9820

$7,455.0000

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Product parameters
PDF(1)
TYPEDESCRIPTION
MfrMill-Max
Series856
PackageBulk
Product StatusACTIVE
Connector TypeMating Target
Contact FinishGold
Mounting TypeThrough Hole, Solder Cup
MaterialBrass Alloy
Pitch0.050" (1.27mm)
Contact Finish Thickness10.0µin (0.25µm)
Number of Contacts10
Number of Rows1

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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